Transfer Moulding & Eproxy Mould Compound Technology Workshop

Introduction

This workshop will provide participants with knowledge and understanding of the roles and effect of different generic additives and fillers used in IC encapsulation and their impact on properties and specifications. The changes in properties and the metrology used for testing will be highlighted for participants to interpret the specification sheets and understand the appropriate properties required for material selection, finite element modelling and product qualification. Issues encountered in qualification of transfer moulding process and materials, including interaction with other packaging material such substrate, lead frame, die attach, gold and copper wire interconnection, and their root causes will also be highlighted.

Who Should Attend

Packaging, Process, R&D/NPI, Materials, Sub-Con, Quality Control, Reliability, and Failure Analysis Managers and Engineers

  • Generic manufacturing process and parameters of clear and epoxy mould compound
  • Understand why compound shipments are always partially cured on arrival and how it affects your transfer moulding parameters and yield
  • Introduction to key mould compound properties and analysis and understand their implications
  • Understand why you should never use TDS data for new product BoM
  • Storage and proper handling of clear and epoxy mould compound
  • Understanding shelf life and implication of extended storage in fridge
  • Thawing procedure that you should be aware to avoid moisture exposure and voiding
  • Understanding pot life and implication of extended exposure to production floor
  • Understand the effects of longer staging time to your advantage while managing the risk
  • Handling of left-over thawed batch and expired material and understand implication of usage
  • Precaution required when extending shelf life of expired material
Dr. Spencer Chew

Dr Spencer Chew has thirty years of experience in new product design and qualification, material characterization, failure analysis, and reliability in the semiconductor industry. He spent 15 years working as a Designer at Philips Singapore, a Scientist at Perkin-Elmer, and a member of the Technical Staff at the Institute of Microelectronics before joining Hewlett-Packard/Agilent Technologies in 1998 as Technology Manager (ASIC Package and Optical Product Development). As Global R&D Director at Cookson Electronics between 2003 and 2008, he led R&D teams in the US, India, and Singapore in the development of underfill and epoxy mold compound. His other appointments include Director of Avago Technologies and CTO of Inari-Amertron Bhd. He is currently an adjunct lecturer for material science and engineering modules. Dr Chew graduated with a BEng and a PhD in Materials Engineering from Monash University, Australia. He has authored more than 30 publications in journals and international conferences on thermal characterization and failure analysis of IC packaging materials.

  • Dates
    6 – 7 December 2017
  • Duration
    2 Days
  • Time
    9.00 am – 5.00 pm
  • Course Fee
    RM3,200/participant
    (excluding 6% GST).
  • Course fees are HRDF claimable under the SBL Scheme.