About This Course
This 3-day course builds strong fundamentals in semiconductor packaging, with emphasis on core assembly processes and the underlying physics and materials science. Participants will learn package types, end-to-end manufacturing flow, and key materials, while understanding how electrical, thermal, and mechanical principles drive real industry applications, performance, and reliability. Designed for fresh graduates and junior engineers, it bridges theory with practical manufacturing insight to prepare them for roles in semiconductor assembly and packaging.
Learning Objectives
- The growing shortage of skilled semiconductor engineers is driving strong competition for talent across local companies, highlighting the need for structured industry training.
- To bridge fundamental semiconductor theory with real-world packaging manufacturing practices, enabling engineers to translate knowledge into practical industry application.
- An opportunity to build industry-ready semiconductor talent by bridging theory and practice, aligned with Malaysia’s NSS workforce development goals.
Prerequisites
Completed Entry level training or passed minimum criteria in pre-assessment quiz.
Target Audience
- Process engineers
- Manufacturing engineers
- Yield improvement engineers
- Process development engineers
Training Outline
DAY 1 — Assembly Process & Integration Fundamentals
Module 1: Assembly Process Flow Deep Dive
- End-to-end flow: wafer → final test
- Purpose of each process step
- Where value is added vs where risk is introduced
Module 2: Wafer Preparation & Die Attach
- Wafer thinning and dicing
- Die attach materials (epoxy, solder)
- Key parameters: temperature, placement, cure
- Common defects: voids, tilt, misalignment
Module 3: Wire Bonding Fundamentals
- Bond formation (ball bond, stitch bond)
- Key parameters: force, ultrasonic energy, temperature
- Common defects: NSOP, lifted bond, wire sweep
- Impact to electrical performance
Module 4: Molding, Singulation & Ball Attach
- Transfer molding basics
- Warpage, delamination mechanisms
- Singulation methods
- Ball attach basics (for BGA)
Module 5: Process Integration & Interaction
- Upstream vs downstream dependency
- Examples:
- Die attach → wire bond quality
- Molding → reliability/test failures
- Introduction to process window concept
DAY 2 — Yield, Test Methodology & Defect Analysis
Module 6: Yield Fundamentals (Product vs Process Yield)
- Yield definitions: unit, lot, line
🔹 Product Yield Loss (Non-Assembly Related)
- Origin: wafer fabrication / design
- Detected at electrical test
- Examples: parametric fail, functional fail
🔹 Process Yield Loss (Assembly Related)
- Origin: assembly processes
- Detected via:
- Visual inspection
- Electrical test (assembly-induced failures)
- Examples: opens, shorts, cracks, missing balls
Module 7: Test Methodology in Assembly
- Purpose of test: defect detection + screening
🔹 Test Flow
- Wafer sort (baseline)
- Final test (post-assembly)
- Burn-in (intro)
🔹 Defect Detection via Test
- Open → bond failure
- Leakage → short / contamination
- Intermittent → delamination / crack
🔹 Correlation Concept
- Wafer pass → Final fail = assembly issue
- Wafer fail → Final fail = wafer issue
🔹 Test Coverage Basics
- Parametric vs functional test
- Limits and screening
Module 8: Defect Mechanisms by Process
- Die attach: voids, misplacement
- Wire bond: NSOP, lift, sweep
- Molding: delamination, cracks
- Ball attach: bridging, missing balls
Module 9: Failure Analysis Basics
- Visual inspection techniques
- Electrical signature interpretation
- Cross-section (basic concept)
- Linking failure to process step
Module 10: Root Cause Analysis (RCA)
- Why
- Fishbone diagram
- Pareto analysis
Module 11: Case Study Workshop
- Yield drop at final test scenario
- Identify:
- Product vs process yield loss
- Likely root cause
- Next actions
DAY 3 — DOE, Data Analysis & Process Improvement
Module 12: Introduction to DOE (Design of Experiments)
- Why DOE (vs trial-and-error)
- Key concepts:
- Factors, levels, response
- Types:
- One-factor-at-a-time (limitation)
- Full factorial (basic concept)
Module 13: DOE in Assembly Processes
- Example applications:
- Wire bond parameter optimization
- Die attach void reduction
- How to design a simple DOE:
- Select factors
- Define response
- Basic interpretation of results
Module 14: Data Analysis for Process Engineers
- Types of data: Continuous vs discrete
- Basic tools:
- Trend charts
- Pareto charts
- Histogram
- Identifying variation and patterns
Module 15: Process Control & Capability
- Process stability vs variation
- Introduction to:
- Cp / Cpk (concept only)
- Monitoring process drift
- Reaction plans
Module 16: Process Improvement Methodology
- PDCA (Plan-Do-Check-Act)
- Linking DOE + data → improvement
- Reducing variation vs shifting mean
Module 17: Final Integration Case Study
- Scenario: Yield loss after molding or wire bond
- Participants apply:
- Test correlation
- RCA
- DOE thinking
- Data interpretation