About This Course
This 2-day course builds strong fundamentals in semiconductor packaging, with emphasis on core assembly processes and the underlying physics and materials science. Participants will learn package types, end-to-end manufacturing flow, and key materials, while understanding how electrical, thermal, and mechanical principles drive real industry applications, performance, and reliability. Designed for fresh graduates and junior engineers, it bridges theory with practical manufacturing insight to prepare them for roles in semiconductor assembly and packaging.
Learning Objectives
- The growing shortage of skilled semiconductor engineers is driving strong competition for talent across local companies, highlighting the need for structured industry training.
- To bridge fundamental semiconductor theory with real-world packaging manufacturing practices, enabling engineers to translate knowledge into practical industry application.
- An opportunity to build industry-ready semiconductor talent by bridging theory and practice, aligned with Malaysia’s NSS workforce development goals.
Prerequisites
2 years of Semicon Engineering manufacturing background or Fresh grad of engineering degrees.
Target Audience
Entry/Fundamental Level
- Fresh engineering graduates
- Production technicians
- Junior engineers entering semiconductor manufacturing
- Quality assurance personnel
Training Outline
Module 1: Role & Importance of Semiconductor Packaging
- Functions: electrical, thermal, mechanical protection
- Why packaging is critical to cost, performance, reliability
- Packaging vs wafer fabrication (big picture)
Module 2: Semiconductor Industry Ecosystem
- Foundry, Fabless, OSAT, IDM roles
- End-to-end flow: design → wafer → packaging → product
- Where packaging fits in the value chain
Module 3: Legacy Package Types
- Through-hole: DIP, SIP
- Surface mount: QFP, PGA, BGA
- Evolution: pin count, size, performance
Module 4: Package Structure Basics
- Die, leadframe/substrate
- Bond wires, mold compound
- Solder balls / external connections
Module 5: Assembly Process Flow (Overview)
- Wafer prep → Die attach → Wire bond
- Molding → Singulation → Ball attach
- Final test
Module 6: Detailed Assembly Process
- Wafer thinning & dicing
- Die attach methods
- Wire bonding fundamentals
- Molding and encapsulation
Module 7: Key Process Modules & Equipment
- Die bonder, wire bonder
- Molding press, ball mounter
- Test equipment
- Function of each process
Module 8: Materials & Basic Physics
- Materials: substrate, wire, mold, solder
- Electrical basics (signal path, noise)
- Thermal basics (heat dissipation)
- Mechanical basics (CTE, stress)
Module 9: Reliability & Common Failures
- Delamination, cracks, wire issues
- Voids and defects
- Impact of materials and process variation
Module 10: Basic Problem-Solving
- 5 Why, Fishbone
- Identifying root cause
- Simple manufacturing case study