Responsibilities

1. PCB Layout & Design

• Design and develop complex multi-layer PCB layouts using Cadence Allegro PCB Designer, transforming schematics into optimized physical designs.
• Perform strategic component placement considering signal flow, thermal management, mechanical constraints, connector locations, and assembly accessibility.
• Execute high-density routing including single-ended signals, differential pairs, high-speed traces, and controlled impedance lines.
• Define and optimize PCB stack-up including layer count, material selection, copper weights, dielectric thickness, and impedance calculations.
• Implement advanced routing techniques for high-speed digital interfaces (DDR, PCIe, USB, HDMI, Ethernet, etc.) and RF/analog circuits.

 

2. Constraint Management & Design Rules

• Define and maintain comprehensive design constraints using Allegro Constraint Manager, including spacing rules, differential pairs, impedance requirements, and length matching specifications.
• Establish electrical constraint sets covering trace width/spacing, via structures, clearances, and manufacturing design rules.
• Implement timing constraints including matched length groups, propagation delay budgets, and phase matching for critical signals.
• Configure and validate design rule checks (DRC) to ensure compliance throughout the design process.

 

3. Library Management & Component Creation

• Create, verify, and maintain ECAD libraries including schematic symbols, PCB footprints (land patterns), and pad stack definitions.
• Develop component footprints following IPC-7351 standards with appropriate tolerances for manufacturing and assembly.
• Coordinate with component engineering and supply chain teams to ensure library accuracy and currency.
• Implement library version control and documentation practices.

 

4. Signal & Power Integrity Collaboration

• Ensure PCB designs meet signal integrity (SI), power integrity (PI), and impedance control requirements through careful design practices.
• Collaborate with SI/PI engineers to implement simulation recommendations including termination schemes, decoupling strategies, and return path optimization.
• Design robust power distribution networks (PDN) with appropriate plane structures, decoupling capacitor placement, and voltage rail isolation.
• Implement controlled impedance routing with specified trace geometries and reference plane assignments.

 

5. Mechanical Integration & 3D Coordination

• Work with 3D STEP models to ensure proper mechanical fit, component clearances, connector alignment, and enclosure integration.
• Coordinate with mechanical engineers on board outlines, mounting holes, keep-out zones, and height restrictions.
• Perform 3D interference checks and mechanical design rule validation.
• Support thermal management design including heatsink interfaces and thermal via structures.

 

6. Manufacturing Coordination & Documentation

• Coordinate with PCB fabrication and assembly vendors to support manufacturing processes and resolve technical issues.
• Generate complete manufacturing documentation including Gerber files (RS-274X), ODB++ data, NC drill files, assembly drawings, fabrication drawings, BOMs (Bill of Materials), and fab notes.
• Provide technical support during fabrication, answering vendor questions and reviewing fab drawing approvals.
• Conduct design for manufacturability (DFM) and design for assembly (DFA) reviews to optimize yield and reduce costs.

 

7. Quality Assurance & Verification

• Perform comprehensive Design Rule Checks (DRC) and troubleshoot layout issues to ensure design quality and manufacturability.
• Execute electrical rule checks (ERC), constraint validation, and cross-probing verification against schematics.
• Review and validate manufacturing outputs before release.
• Ensure designs comply with relevant industry and quality standards including IPC standards, ANSI, ISO, and ITAR compliance where applicable.

Requirements

Must Have:

• Bachelor's Degree in Electrical Engineering, Electronics Engineering, or related engineering discipline.
• Minimum 2–4 years of hands-on PCB layout experience in professional product development environment.
• Strong experience designing complex, multi-layer PCBs (6+ layers) using Cadence Allegro (mandatory).
• Proficient in Cadence Allegro PCB Designer and Constraint Manager with deep working knowledge of design flows and capabilities.

 

• Strong understanding of:
  • Multi-layer PCB layout and routing methodologies
  • High-density PCB design techniques
  • Differential pair routing and timing
  • Length matching and delay tuning
  • Signal Integrity (SI) principles and best practices
  • Power Integrity (PI) and PDN design
  • Controlled impedance design and calculations

 

• Experience creating and maintaining ECAD libraries including footprints, symbols, and pad stacks following industry standards.
• Knowledge of DFM (Design for Manufacturability), DFA (Design for Assembly), and DFT (Design for Test) principles.
• Experience working with 3D STEP models for mechanical integration and interference checking.
• Familiarity with manufacturing deliverables including Gerber files, ODB++, drill files, BOMs, assembly drawings, and fabrication documentation.
• Strong analytical and problem-solving skills with systematic debugging approach.
• Excellent attention to detail and commitment to design quality.
• Good communication and interpersonal skills for cross-functional collaboration.
• Ability to collaborate effectively with hardware engineers, mechanical designers, SI/PI specialists, and external vendors.
• Able to manage multiple projects and meet deadlines in fast-paced development environment.

 

Good to Have:

• Familiarity with IPC standards (IPC-2221, IPC-2222, IPC-7351, IPC-6012) for PCB design and manufacturing.
• Experience with ANSI, ISO, and ITAR compliance requirements for regulated industries.
• Exposure to high-speed digital interfaces (DDR3/4/5, PCIe Gen 3/4/5, USB 3.x, HDMI, DisplayPort, 10G/25G Ethernet).
• Knowledge of RF/microwave PCB design techniques.
• Familiarity with rigid-flex and flexible PCB design.
• Experience with blind/buried vias, microvias, and HDI (High-Density Interconnect) technologies.
• Understanding of thermal management and thermal simulation.
• Scripting skills (SKILL, Tcl, or Python) for Allegro automation.
• Knowledge of other EDA tools (Altium, PADS, OrCAD).