About Inari Technology Sdn Bhd
Inari Technology Sdn Bhd is an EMS (Electronics Manufacturing Services) provider of fully integrated Back-end Services for multi-chips; multi-dice; substrate-based SiP (System in package) devices. One of the biggest companies in ASEAN performing and providing DC and RF wafer testing, wafer back-grinding, sawing, wire bonding, substrate molding, substrate sawing and RF package testing.
Our hybrid packaging processes cover from fine-pitch, flip-chip SMTA, die attach, wire bonding, substrate molding to substrate sawing.
Inari Technology is a one-stop solution provider for high volume manufacturing of integrated circuit package assembly until final testing. In-house packaging and process development team with full fledge engineering capabilities. It’s the best place to start off your career opportunities.