Inari Technology Sdn Bhd is an EMS (Electronics Manufacturing Services) provider of fully integrated Back-end Services for multi-chips; multi-dice; substrate-based SiP (System in package) devices. One of the biggest companies in ASEAN performing and providing DC and RF wafer testing, wafer back-grinding, sawing, wire bonding, substrate molding, substrate sawing and RF package testing.
Our hybrid packaging processes cover from fine-pitch, flip-chip SMTA, die attach, wire bonding, substrate molding to substrate sawing.
Inari Technology is a one-stop solution provider for high volume manufacturing of integrated circuit package assembly until final testing. In-house packaging and process development team with full fledge engineering capabilities. It’s the best place to start off your career opportunities.
Interested candidates are invited to apply online with a full resume stating qualifications, contact number, working experience, and expected salary together with a recent passport-sized photograph to :-
- Shenny Foo
- inari-career@inari-amertron.com.my
- 604-6456618
- Plot 51, Sungai Hilir Keluang Empat, Phase 4, Bayan Lepas Free Industrial Zone, 11900 Bayan Lepas, Penang