Transfer Moulding & Epoxy Mould Compound Technology Workshop


This workshop will provide participants with knowledge on understanding the roles and effect of different generic additives and fillers used in IC encapsulation and their impact on properties and specifications. The changes in properties and the metrology used for testing will highlighted so that participants shall be able to interpret specification sheets and understand the appropriate properties required for material selection, finite element modelling and product qualification. Finally, issues encountered in qualification of transfer moulding process and material, including interaction with other packaging material such substrate, leadframe, die attach, gold and copper wire interconnection and root causes shall be highlighted.



Packaging, Process, R&D/NPI, Materials, Sub-Con, Quality Control, Reliability, Failure Analysis Managers and Engineers


2 Days (9.00 am – 5.00 pm)


6 – 7 December 2017 @ PSDC, Penang


RM3,200/participant (excluding 6% GST). 100% HRDF Claimable


Dr Spencer Chew has thirty year experience in new product design and qualification, material characterization, failure analysis and reliability in the semiconductor industry. He spent 15 years as designer at Philips Singapore, Scientist at Perkin-Elmer, Member of Technical Staff at Institute of Microelectronics before joining Hewlett-Packard/Agilent Technologies in 1998 as Technology Manager (ASIC package and optical product development). As Global R&D Director at Cookson Electronics between 2003 and 2008, he led R&D teams in US, India and Singapore in the development of underfill and epoxy mold compound. His other appointments include Director, Avago Technologies and CTO, Inari-Amertron Bhd. Currently, he lectures material science and engineering modules as adjunct lecturer. Dr Chew graduated with BEng and PhD in Materials Engineering from Monash University, Australia. He has authored more than 30 publications in journals and international conferences on thermal characterization and failure analysis of IC packaging materials.


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